? semiconductor components industries, llc, 2011 july, 2011 ? rev. 4 1 publication order number: sm05t1/d sm05t1 series transient voltage suppressor diode array sot ? 23 dual common anode diodes for esd protection these dual monolithic silicon tvs diodes are designed for applications requiring transient overvoltage protection capability. they are intended for use in voltage and esd sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. their dual junction common anode design protects two separate lines using only one package. these devices are ideal for situations wh ere board space is at a premium. specification features: ? sot ? 23 package allows either two separate unidirectional configurations or a single bidirectional configuration ? working peak reverse voltage range ? 5.0 v to 24 v ? peak power ? 300 watt (8 x 20 s) ? low leakage ? flammability rating ul 94 v ? 0 ? these are pb ? free devices mechanical characteristics: case: void-free, transfer-molded, thermosetting plastic case finish: corrosion resistant finish, easily solderable maximum case temperature for soldering purposes: 260 c for 10 seconds package designed for optimal automated board assembly small package size for high density applications available in 8 mm tape and reel use the device number to order the 7 inch/3,000 unit reel replace the ?t1? with ?t3? in the device number to order the 13 inch/10,000 unit reel sot ? 23 case 318 style 12 1 3 2 1 2 3 pin 1. cathode 2. cathode 3. anode marking diagram http://onsemi.com device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. sm05t1g sot ? 23 (pb ? free) 3000/tape & reel sm12t1g sot ? 23 (pb ? free) 3000/tape & reel *date code orientation and/or overbar may vary depending upon manufacturing location. 1 xxm m xxm = device code xx = 05, 12, 15, 24, 36 m = date code* =pb ? free package (note: microdot may be in either location) sm15t1g sot ? 23 (pb ? free) 3000/tape & reel SM24T1G sot ? 23 (pb ? free) 3000/tape & reel sm36t1g sot ? 23 (pb ? free) 3000/tape & reel
sm05t1 series http://onsemi.com 2 maximum ratings rating symbol value unit peak power dissipation @ 20 s (note 1) @ t l 25 c p pk 300 w iec 61000 ? 4 ? 2 (esd) air contact 15 8.0 kv iec 61000 ? 4 ? 4 (eft) 40 a iec 61000 ? 4 ? 5 (lightening) 12 a total power dissipation on fr ? 5 board (note 2) @ t a = 25 c derate above 25 c thermal resistance, junction ? to ? ambient p d r ja 225 1.8 556 mw mw/ c c/w total power dissipation on alumina substrate (note 3) @ t a = 25 c derate above 25 c thermal resistance, junction ? to ? ambient p d r ja 300 2.4 417 mw mw/ c c/w junction and storage temperature range t j , t stg ? 55 to +150 c lead solder temperature ? maximum (10 second duration) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. non ? repetitive current pulse per figure 3 2. fr ? 5 = 1.0 x 0.75 x 0.62 in. 3. alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina note: other voltages may be available upon request electrical characteristics unidirectional (circuit tied to pins 1 and 3 or 2 and 3) symbol parameter i pp maximum reverse peak pulse current v c clamping voltage @ i pp v rwm working peak reverse voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current v br maximum temperature coefficient of v br i f forward current v f forward voltage @ i f z zt maximum zener impedance @ i zt i zk reverse current z zk maximum zener impedance @ i zk uni ? directional tvs i pp i f v i i r i t v rwm v c v br v f electrical characteristics (t a = 25 c unless otherwise noted) device device marking v rwm i r @ v rwm v br , breakdown voltage i t v c @ i pp = 1 amp max i pp (note 4) typical capacitance (volts) (pf) (volts) ( a) min max ma (volts) (amps) pin 1 to 3 @ 0 volts sm05t1g 05m 5 10 6.2 7.3 1.0 9.8 17 225 sm12t1g 12m 12 1.0 13.3 15.75 1.0 19 12 95 sm15t1g 15m 15 1.0 16.7 19.6 1.0 24 10 100 SM24T1G 24m 24 1.0 26.7 31.35 1.0 43 5.0 60 sm36t1g 36m 36 1.0 40.0 46.95 1.0 60 4.0 45 4. 8 20 s pulse waveform per figure 3
sm05t1 series http://onsemi.com 3 typical characteristics 0.1 10 10 figure 1. non ? repetitive peak pulse power versus pulse time 1 t p , pulse duration ( s) 100 1000 1 0.1 0.01 figure 2. steady state power derating curve p pp , peak pulse power (kw) 0 25 50 75 100 125 150 175 300 250 200 150 100 50 0 temperature ( c) fr ? 5 board alumina substrate p d , power dissipation (mw) 100 figure 3. 8 20 s pulse waveform figure 4. typical diode capacitance (sm05) 01 5 24 250 130 90 bias voltage (volts) 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s half value i rsm /2 @ 20 s % of peak pulse current peak value i rsm @ 8 s c, capacitance (pf) 210 170 figure 5. typical diode capacitance (sm12) 015812 100 90 40 30 20 10 0 bias voltage (volts) c, capacitance (pf) 80 70 60 50 3
sm05t1 series http://onsemi.com 4 typical common anode applications a quad junction common anode design in a sot ? 23 package protects four separate lines using only one package. this adds flexibility and creativity to pcb design especially when board space is at a premium. two simplified examples of tvs applications are illustrated below. keyboard terminal printer etc. functional decoder i/o a sm05t1 series gnd computer interface protection b c d microprocessor protection i/o ram rom clock cpu control bus address bus data bus gnd v gg v dd sm05t1 series sm05t1 series
sm05t1 series http://onsemi.com 5 package dimensions sot ? 23 (to ? 236) case 318 ? 08 issue an mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 style 12: pin 1. cathode 2. cathode 3. anode *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* d a1 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318 ? 01 thru ? 07 and ? 09 obsolete, new standard 318 ? 08. view c l 0.25 l1 e e e b a see view c dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 nom max l1 h 2.10 2.40 2.64 0.083 0.094 0.104 h e 0.35 0.54 0.69 0.014 0.021 0.029 c on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 sm05t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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